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Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate TIAN Yan-hong(田艳红)1, WANG Chun-qing(王春青)1, Y. Norman ZHOU2 1. State Key Laboratory of Advanced Welding...; Abstract: The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated......
Effect of ultrasonic power on wedge bonding strength and interface microstructure WANG Fu-liang(王福亮), LI Jun-hui(李军辉), HAN Lei(韩 雷), ZHONG Jue(钟 掘) School of Mechanical and Electrical...; Abstract: During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based......
Interface structure of ultrasonic wedge bonding joints of Ni/Al LI Jun-hui(李军辉), HAN Lei(韩 雷), ZHONG Jue(钟 掘) (School of Mechanical-Electronical Engineering, Central South University... power is applied. Moreover, the machine variables have an optimal range for microstructure characteristics. Key words: Ni/Al; electronics packaging; wedge bonding; microstructure; ultrasonic CLC number......
off in wedge bonding. For thermosonic flip chip bonding, the high power decreases position precision of bonding or results in slippage and rotation phenomena of bumps. To improve reliability and precision of thermosonic bonding, the low ultrasonic power (about 1-5 W) should be chosen. Key words: ultrasonic power; wedge bonding; thermosonic flip chip; input impedance; failure  ......
bonding, the temperature of aluminum wedge bonding process was 200-300 ℃ tested by Tsujino et al[5,6] through measuring thermoelectromotive force voltage between aluminum wire and substrate... scanning on vertical section of Au/Al bonding by using STEM model Table 1 Result of EDS-test at atomic diffusion point The velocity of vibration at wedge capillary was tested by using PSV-400-M2......
method of achieving this interconnection is the ball-edge bonding process that consists of ball bonding step at one end of the interconnection and wedge bonding step at the other end. A typical wire...- compression bonding of Au wires to Al electrode on semiconductor devices[J]. Japan Institute of Metals, 1977, 41(5): 1161-1165. [15] DAWES C J. Ultrasonic ball wedge bonding of aluminum wires[J......
J. Cent. South Univ. (2017) 24: 854-860 DOI: 10.1007/s11771-017-3487-8 Finite element analysis and experiment on multi-wedge cross wedge rolling for asymmetric stepped shaft of C45 JI Hong-chao(纪宏超... South University Press and Springer-Verlag Berlin Heidelberg 2017 Abstract: A rigid-plastic finite element method (FEM) simulation model for a multi-wedge cross wedge rolling (MCWR) was developed......
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; 文献标志码:A Microstructure and fracture behaviour of spray-deposited SiCp/Al-Fe-V-Si sheet as-rolled after wedge pressing HE Yi-qiang1, 2, HU Jan-bin3, ZHANG Yi3, CHEN Zhi-gang4, FENG... was densified by wedge pressing, and then was hot-rolled into sheets. The evolutions of pore, SiC particles distribution, second-phase dispersions during wedge pressing and SiC/Al interface of composite......
Temperature effect in thermosonic wire bonding WU Yun-xin(吴运新), LONG Zhi-li(隆志力), HAN Lei(韩 雷), ZHONG Jue(钟 掘) School of Electromechanical Engineering, Central South University, Changsha 410083...; Abstract: The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material......